AGFD023R24C2I1V System On Chip (SoC)_E-COMP GROUP INC_Integrated Circuit IC_Resistor_Capacitor_Potentiometer_Transformer_Discrete semiconductor_Memory_CPU_Diode_Triode_LED light emitting diode

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AGFD023R24C2I1V


：	AGFD023R24C2I1V
：	System On Chip (SoC)
：	Intel
：	IC
：	-
：	Tray
：	100
：

: 100

3

$29,893.0300

$89,679.0900

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Product parameters

TYPE	DESCRIPTION
Mfr	Intel
Series	Agilex F
Package	Tray
Product Status	ACTIVE
Package / Case	2340-BFBGA Exposed Pad
Speed	1.4GHz
RAM Size	256KB
Operating Temperature	-40°C ~ 100°C (TJ)
Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes	FPGA - 2.3M Logic Elements
Connectivity	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals	DMA, WDT
Supplier Device Package	2340-BGA (45x42)
Architecture	MPU, FPGA

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0755- 323 302 3678

scarlett@usecgi.com

martin@usecgi.com