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AGFA023R24C2E1V

  •  AGFA023R24C2E1V
  • image of System On Chip (SoC) AGFA023R24C2E1V
Part number AGFA023R24C2E1V
Product Category System On Chip (SoC)
Manufacturer Intel
Description IC
Encapsulation -
Packaging Tray
Quantity 100
RoHS Status
IN STOCK: 100
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Product parameters
TYPEDESCRIPTION
MfrIntel
SeriesAgilex F
PackageTray
Product StatusACTIVE
Package / Case2340-BFBGA Exposed Pad
Speed1.4GHz
RAM Size256KB
Number of I/O480
Operating Temperature0°C ~ 100°C (TJ)
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary AttributesFPGA - 2.3M Logic Elements
ConnectivityEBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDMA, WDT
Supplier Device Package2340-BGA (45x42)
ArchitectureMPU, FPGA
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